HRN EN 60068-2-58:2008
Environmental testing -- Part 2-58: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004; EN 60068-2-58:2004)
| Oznaka: | HRN EN 60068-2-58:2008 |
| Naslov (EN): | Environmental testing -- Part 2-58: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (IEC 60068-2-58:2004; EN 60068-2-58:2004) |
| Područje primjene (EN): | Outlines test Td, applicable to surface mounting devices, which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead and for lead-free solder alloys. Provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys and for determining the solderability, dissolution of metallization (see B.3.3) and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders. Include the solder bath method and reflow method. |
| Izdanje: | 1 |
| ICS: | 19.040 Ispitivanje utjecaja okoliša 31.190 Sklopovi elektroničkih sastavnih dijelova |
| Tehnički odbor/pododbor: | TU V1, Elektronika 1 |
| Oznaka faze: | 95.99 - povlačenje HRN |
| Glasilo (rasprava): | 4/2008 () |
| Glasilo (objava): | 5/2008 () |
| Glasilo (povlačenje): | 10/2018 () |
| Način prihvaćanja: | pr - prihvaćanje strane norme u izvorniku |
| Cijena #1: | Cijena: 41,00 € | Jezik: en | Cjenovni razred: G | Broj stranica: 29 |
| Izvornik: | EN 60068-2-58:2004 |
| Zamjenjena s: | HRN EN 60068-2-58:2015 |
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